Supporting Coolant Distribution for AI + HPC Thermal Loads
Modern AI and HPC clusters are pushing rack densities beyond the limits of traditional cooling. Our 2-24 MW CDUs deliver the redundancy and configurability required to support next generation direct-to-chip cooling.
Standard Options
2-24 MW heat transfer capacity
N+1 or N+N redundancy for pumps, controls, and HX assemblies
Gasketed plate and frame heat exchangers
Variable-speed pump skids
Built-in expansion tank and fluid monitoring
BACnet/IP, Modbus, and BMS-friendly controls
Configurable Ranges
Coolant supply temperature
ΔT range
Flow rates up to 6,000 GPM depending on configuration
Floor or skid mount footprint
Electrical: 480V/3p
Commissioning & Documentation
We provide a complete comissioning package including:
Factory Acceptance Testing (FAT)
On-site startup & balancing
Control-logic verification
O&M manuals, sequence of operation, and as-built documentation
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